Fine Ceramics

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Fine Ceramics

Product Name Alumina(Al₂O₃) Aluminum Nitride(AlN) Sapphire
Product Description Used in core parts of semiconductors due to high strength and resistance against wear and heat High heat conductivity and electrical insulation, as well as outstanding resistance against thermal shock and plasma Material with higher strength than Al₂O₃ by refining high purity Al₂O₃
Application Core parts inside the semiconductor chamber Heat Sink, Base board, Soaking Plate for Heater Parts for Etcher Process
Product Type Gas Inject, Window, Ring, Arm, etc. Ring, Plate, Crucible Window, Focus Ring, Injector
Product Name Silicon Pad YAS Si₃N₄
Product Description Used as heat or electrical onductive medium in etching equipment Better plasma characteristics than Al₂O₃ products, and used by coating YAS material on the surface of products directly exposed to plasma High electrical insulation and heat conductivity, and used as base for Probe Cards, Electric Power Semiconductor Modules, and Automobile Invertor Modules
Application Heat conduction parts within Etcher equipment Semiconductor Dry Etching process Probe Card Guide, Electric Power Semiconductor and Automobile Invertor
Product Type Thermal Pad Window, ESC EDGE RING Si₃N₄ Circuit Board

SiC

Product Name SiC Ring Susceptor SiC Boat
Product Description Parts to maintain etching
uniformity by keeping
plasma consistent at the
outer boundaries of the wafer		 Thin Film parts of wafer in
Epi process		 Parts that safely position
several wafers in order to
coat thin oxide film during process
Application Etcher process Thin Film process CVD process, Diffusion process, etc.
Type Focus Ring, Insert Ring,
Edge Ring (Hot, cool)		 8” / 12” Susceptor Baffle Boat, 8” / 12” Long Boat